UNJournal Jon Lee | Samsung Electronics announced the world's first mass production shipment of HBM4, a key component in the artificial intelligence industry.

Samsung, which has lagged behind in the HBM market, has seized the opportunity to once again dominate the market with this HBM4 shipment.

Samsung Electronics Vice President of Memory Development Hwang Sang-joon stated, "Samsung Electronics' HBM4 breaks the mold of previous, proven processes by applying cutting-edge processes like 1c DRAM and Foundry 4nm."

"By securing sufficient room for performance expansion through process competitiveness and design improvements, we were able to meet our customers' performance demands in a timely manner."

Notably, HBM4 has adopted low-power design technology for the core die to address power consumption and heat concentration issues.

Furthermore, the company announced that it has improved energy efficiency by approximately 40% compared to the previous generation through the application of low-voltage design technology for TSV data transmission and reception and an optimized power distribution network (PDN).

Samsung Electronics' HBM4 delivers both top-tier performance and stable reliability optimized for data center environments, allowing customers to maximize GPU computing performance while reducing power consumption and cooling costs for servers and data centers.

Following HBM4, Samsung Electronics is also preparing HBM4E, with sample shipments planned for the second half of 2026.

The quality and supply stability achieved through the 1c process during HBM4 mass production are expected to be key competitive factors in the transition to high-value-added products such as HBM4E and custom HBM.